Samsung and SAP Open Research Center for Next-generation In-memory Platform

182

Samsung and SAP SE, today held the opening ceremony for a joint research center where engineers will conduct R&D for memory solutions to be used in next-generation in-memory computing.

The ceremony was held at Samsung Electronics’ Hwaseong campus in South Korea with Dr. Young-Hyun Jun, President of Samsung Electronics’ Memory Business and Adaire Fox-Martin, President, SAP Asia Pacific Japan participating, as well as other executives from both companies.

The establishment of the research center is part of an extended partnership between the two world-leading corporations, under which the two will focus on in-memory technology development that enables faster data processing and more insightful analyses of rapidly increasing amounts of data.

The two companies intend to lead the push for more advanced global in-memory market offerings by conducting cutting-edge research of next-generation DRAM for customer solutions and working together on their commercialization.

At the research center, Samsung and SAP will provide global customers with optimized in-memory solutions through the provisioning of extensive technical support including test runs of the SAP HANA platform and evaluation of Samsung’s latest high-performance, high-density memory solutions.

The server system at the center uses a 24-terabyte (TB) in-memory platform, which is based on Samsung’s 128-gigabyte (GB) DDR4 3DS (three-dimensional stacked) DRAM modules fabricated on the 20-nanometer process node. The companies plan to apply 10nm-class 256GB 3DS DRAM modules next year to improve overall system performance and power efficiency, which is expected to lead to an in-memory system that will offer even greater return on investment for Samsung and SAP customers.

“With our latest 10nm-class DRAM technology, Samsung Electronics will be able to provide more advanced solutions for SAP’s next-generation in-memory system in a highly efficient manner” said Dr. Young-Hyun Jun, President of the Memory Business, Samsung Electronics.

“Samsung will continue solidifying its technology leadership in the high-density memory market through ongoing innovation.”

Adaire Fox-Martin, President, SAP Asia Pacific Japan added,

“Together with Samsung Electronics, we will develop the next generation of in-memory solutions for customers using the SAP HANA platform. This collaboration with Samsung extends our partnership and represents our commitment to drive innovation and help our customers win in the digital economy,”

Rapid Mobile
 
Rapid Mobile uses cookies, tokens, and other third party scripts to recognise visitors of our sites and services, remember your settings and privacy choices, and - depending on your settings and privacy choices - enable us and some key partners to collect information about you so that we can improve our services and deliver relevant ads.

 

By continuing to use our site or clicking I Accept, you agree that Rapid Mobile and our key partners may collect data and use cookies for personalised ads and other purposes, as described more fully in our privacy policy.

 

You can change your settings at any time by clicking Manage Settings or by visiting our Privacy Centre for more detailed information.

 

Privacy Settings saved!
Cookie Services

When you visit any website, it may store or retrieve information on your browser, mostly in the form of cookies. Because we respect your right to privacy, you can choose not to allow some types of cookies. Click on the different category headings to find out more and change our default settings. However, blocking some types of cookies may impact your experience of the site and the services we are able to offer.

These cookies allow us to count visits and traffic sources, so we can measure and improve the performance of our site.

We track anonymized user information to improve our website.
  • _ga
  • _gid
  • _gat

Decline all Services
Accept all Services